作者观点:
创新研报|2024半导体封装设备行业深度-封装设备迎国产化机遇
Tom Lin
+ 关注
本报告深入探讨了半导体封装设备行业的发展现状和前景,分析了先进封装技术的快速发展和封测产业链国产化率较低的问题,介绍了传统与先进封装设备的重合以及增量主要在前道图形化设备方面。同时,推荐了国内封装设备公司并提出了投资建议和风险提示。
There was a problem reporting this post.
Please confirm you want to block this member.
You will no longer be able to:
Please note: This action will also remove this member from your connections and send a report to the site admin. Please allow a few minutes for this process to complete.